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ALPHA Vaculoy SACX0307

ALPHA Vaculoy SACX0307 is a patented (US Patent No 4,929,423) lead-free alloy suitable for use as a replacement for Sn63 alloy in the wave solder process. The SACX0300 variant is used to stabilize / reduce the copper content in the wave solder bath, this requirement will depend on process conditions. As with all Alpha Metals bar solder, Alpha’s proprietary Vaculoy alloying process is used to remove certain impurities, particularly oxides. The product is further enhanced with the addition of 2 minor elements to reduce dross formation and improve the joint cosmetics.

Please note that the English version provides the most complete and up-to-date information. There is a delay in updating local language information.
Product Documentation
Technical Bulletins
ALPHA Vaculoy SACX0307 Technical Bulletin (English)
ALPHA Vaculoy SACX0307 Technical Bulletin (Spanish)
ALPHA Vaculoy SACX0307 Technical Bulletin (Chinese)
Product Flyer
ALPHA Vaculoy SACX0307 Product Flyer (English)
Product Guide
ALPHA Vaculoy SACX0307 Product Guide (English)
Reference Bulletins
Global Item Numbers SACX Reference Bulletin (English)
SACX Global Item Numbers Reference Bulletin (English)
Mixing Lead-Free Alloys in PCB Assembly Reference Bulletin (English)
Wetting Test SACX vs SAC0307 Reference Bulletin (English)
SACX Hole Fill Performance Reference Bulletin (English)
SACX Patent and Trademark Reference Bulletin (English)
Guidance on Wave set up to minimize dross Reference Bulletin (English)
Changing a Wave Solder bath from SAC305 to SACX Reference Bulletin (English)
SACX Anti-Oxidant Additive Reference Bulletin (English)
Changing Wave Solder bath from Sn-Pb to Lead-Free Reference Bulletin (English)
Lead-Free Alloys : Stainless Steel Erosion Reference Bulletin (English)
Mixing Lead-Free alloys in PCB Assembly Reference Bulletin (English)
Wave Goodbye to Inferior Yields Reference Bulletin (English)
Lead Free Solders - Lead Content Reference Bulletin (English)
Minimizing the risk of Pb Contaminatio Reference Bulletin (English)
Lead-Free Alloys : Impurity Action Levels Reference Bulletin (English)
Wetting Test SACX vs SAC0307 Reference Bulletin (English)
Guidance on Wave set up to minimize dross - Chinese Reference Bulletin (Chinese)
Wetting Test SACX vs SAC0307 - Chinese Reference Bulletin (Chinese)
SACX Hole Fill Performance - Chinese Reference Bulletin (Chinese)
Lead-Free Alloys : Impurity Action Levels : Chinese Reference Bulletin (Chinese)
Changing a Wave Solder bath from SAC305 to SACX - Chinese Reference Bulletin (Chinese)
Mixing Lead-Free alloys in PCB Assembly - Chinese Reference Bulletin (Chinese)
SACX Patent and Trademark - Chinese Reference Bulletin (Chinese)
Customer Letter - SACX Patent and Trademark - Chinese Reference Bulletin (Chinese)
Wechsel von SAC auf SACX Reference Bulletin (German)
Edelstahlkorrosion Reference Bulletin (German)
Mischen unterschiedlicher bleifreier Legierungen Reference Bulletin (German)
Auswahl bleifreier Legierungen Reference Bulletin (German)
Bleifreie Lote - Bleigehalt Reference Bulletin (German)
SACX HASL - Pentagal Report Reference Bulletin (English)
RoHS Declaration
RoHS-Vaculoy SACX0307-BAR-WWE-SM000 05-08-04 RoHS Declaration (English)
Technical Papers
Development of a L-F Wave Solder Alloy (Campbell-Ingham-B Technical Paper (English)
Lead-Free Wave Solder Alloy Selection Technical Paper (English)
S02-5 IPC Works 2005 Celestica-Cookson-Speedline Technical Paper (English)
TP-Effect of Voiding in Solder Interconnections (LF Technical Subcommittee)-Bar-WWE-SM000 05-12-01 Technical Paper (English)
Drop Shock Reliabilty of Lead-Free Alloys - Effect of Micro-Additives Technical Paper (English)
iNEMI Pb-Free Alloy Alternatives Project Report: State Of The Industry Technical Paper (English)
Effect of Silver in Common Pb-free Alloys Technical Paper (English)
Press Releases
SACX Sales Growth (English)

 

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